工作职责:
1.Set up process specifications, qualify newly installed tools & new product
2.Analyze process deviations and equipment failures, execute solutions&implement control plans to improve operation efficiency & maximize yield
3.Perform process window checks & setup process control limits
4.Work with Process Integration/customers to improve process capabilities and reliability
5.Work closely with manufacturing team on cost reduction and cycle time improvement
任职资格:
1.Degree in Material Science/Chemical/Electronics/Electrical Engineering with more than 6 years of experience in semi-conductor or wafer processing;Fresh is also welcome to us
2.Meet any of the following
1)Experience in Wafer dicing/saw, molding process testing & optimization processes would be a distinct advantage
2)Experience in 200/300*** wafer grinding/dicing, dry film litho/bump related process testing & optimization
3)Experience in PR coating/Litho and PVD/Plating/wet etch/CMP process testing & optimization
4)Experience in Wafer de-bond, soldering/underfill process testing & optimization
3.Familiar with SPC & ability to perform DOE/FMEA to improve process margins will be advantageous.
电话:18012328655(蔡经理)
微信:18262274603
简历请发:hongchun.cai@microsilicontech.com
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