Responsibilities:
Responsible for new powermodule package / platform development
Define product technicalspecification ba
Perform new material study andapply for the new package
Perform new product and processcharacterization
Develop the new machine
Perform EBR sample build beforerelease to production
Improve the process quality andintroducing package cost reduction programs.
To optimize and perform proofof principles independently On existing/newly developed platform/product
Requirements:
Candidate must possess at leasta Bachelor/Master Degree or a Professional Degree in Power electronics ormaterial science or Mechanical
Required skill(s): Packagingdesign knowledge, Power module application, material study
Preferred skill(s): solidworks,autocad.
Applicants must be willing towork in Shenzhen.
Full-Time positions available.
Able to gather, organize andanalyze information/data
Able to postulate potentialcause of problem & identify simulation to test the hypothesis
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